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GB/T 29545-2013機床數控系統 可靠性設計

本標準規定了機床數控系統可靠性設計的基本流程、方法以及評審內容和程序。本標準適用于機床數控系統(以下簡稱“數控系統”)。其他工業機械設備數控系統的可靠性設計可參照本標準。

GB/T 30067-2013金相學術語

本標準界定了金相學和金相檢驗及其相關領域的術語,主要涵蓋了光學顯微術、顯微壓痕硬度測試、樣品制備、X-射線和電子金相學、定量金相學、顯微攝影術、晶粒尺寸和夾雜物含量的測定等金相學領域中廣泛使用的專有名詞。本標準適用于金相學領域中的科研、生產、檢驗、教學、出版、編制標準及國內外科技交流。

GB/T 50668-2011節能建筑評價標準

為貫徹落實節約能源資源的基本國策，引導采用先進適用的建筑節能技術，推動建筑的可持續發展，規范節能建筑的評價，編制本標準。本標準適用于新建、改建和擴建的居住建筑和公共建筑的節能評價。節能建筑評價應符合下列規定：節能建筑的評價應包括建筑及其用能系統，涵蓋設計和運營管理兩個階段；節能建筑的評價應在達到適用的室內環境的前提下進行。 節能建筑的評價除應符合本標準的規定外，尚應符合現行有關標準的規定。

GB 50681-2011機械工業廠房建筑設計規范

本規范適用于下列范圍：1 新建、擴建、改建的機械工業廠房及其附屬建筑的建筑設計；2 機械工業工廠中電離輻射室的建筑設計；3 機械工業工廠中電磁屏蔽室，屏蔽頻率為0.15MHz～30MHz利用建筑物增設屏蔽層的建筑設計。

CECS 411-2015金屬面絕熱夾芯板技術規程

本規程適用于工業與民用建筑屋面板(非上人屋面)、墻面板、天花板、內隔墻、聲屏障等的設計及安裝。

SJ/Z 21336-2018數據鏈設備可靠性設計指南

本指導性技術文件規定了數據鏈設備可靠性設計的一般要求、設計準則和設計方法等。本指導性技術文件適用于指導數據鏈終端設備(含天線)、鏈路綜合處理設備、網絡管理設備等的可靠性設計，其他數據鏈設備可參考使用。

DB11/T 512-2007建筑裝飾工程石材應用技術規程

本規程適用于建筑裝飾工程中裝飾石材的材料、設計、加工制作、施工、驗收以及防護、保養和翻新。

ISO/TTA 4-2002硅基質上薄膜導熱性的測量

1.1 A standard procedure for the three-omega method is proposed for measuring the thermal conductivity ofa thin, electrically insulating film, on a substrate having a thermal conductivity significantly greater than thethermal conductivity of the film. This method is applicable to a film on a silicon substrate with the followingcharacteristics:a) the film is electrically insulating;b) the film has a thermal conductivity that is less than one tenth the thermal conductivity of silicon;c) the film is uniform in thickness and the thickness lies in the range 0,25 μm to 1 μm;d) the maximum dimensions of the film are limited by the sizes of the preparation and measurementapparatus;e) the minimum dimensions of the film are limited by the minimum size of the circuit element that can beplaced on the film surface.NOTE A specimen approximately 15 mm by 25 mm is of an appropriate size although specimens as small as10 mm × 10 mm are usable.1.2 The method is directly applicable to films of silicon dioxide on silicon wafer substrates.1.3 The method may be applicable to insulating films on other high-thermal conductivity substrates providedthat the parameters of the substrate material are substituted for the parameters of silicon used in this methodand the associated computer program.1.4 The method is applicable to measurements near room temperature.

DIN EN 675-2011建筑玻璃.熱傳遞系數(U值)測定.熱流計法;德文版本EN 675-2011

This European Standard specifies a measurement procedure to determine the thermal transmittance of glazing with flat and parallel surfaces. Structured surfaces, e.g. patterned glass, may be considered to be flat...

DIN EN ISO 472-2013塑料.詞匯表(ISO 472-2013).三種語言版本EN ISO 472-2013

This standard defines terms used in the plastics industry, including terms and definitions appearing in plastics standards (of ISO/TC 61), and general terms and definitions of polymer science used in all aspects of plastics technology.

BS EN 675-2011建筑玻璃.熱傳遞系數(U值)的測定.熱流計法

This European Standard specifies a measurement procedure to determine the thermal transmittance ofglazing with flat and parallel surfaces. For the purpose of this Standard, structured surfaces may beconsidered to be flat..This European Standard applies to multiple glazing with outer panes which are not transparent to far infraredradiation (in the wavelength range 5μm to 50μm), which is the case for soda lime silicate glass products,borosilicate glass and glass ceramics. Internal elements can be far infrared transparent.The procedure specified in this European Standard determines the U value (thermal transmittance) in thecentral area of glazing. The edge effects due to the thermal bridge through the spacer of an insulating glassunit or through the window frame are not included. Energy transfer due to solar radiation is also excluded.The procedure specified in this European Standard should be considered only when the thermal transmittanceof the glazing cannot be calculated in accordance with EN 673.The determination of the thermal transmittance is performed for conditions which correspond to the averagesituation for glazing in practice.

BS EN 60194-2006印制板設計、制造和組裝.術語和定義

This International Standard defines the terminology used in the field of printed circuitboards and printed circuit board assembly products.

BS EN 61189-2-2006印制電路板及其互連結構和組件電氣材料的試驗方法.互連結構材料的試驗方法

This part of IEC 61189 provides a catalogue of test methods representing methodologies andprocedures that can be applied to test materials used for manufacturing interconnectionstructures (printed boards) and assemblies.

BS EN 62258-1-2010半導體壓模產品.采購和使用

This part of IEC 62258 has been developed to facilitate the production, supply and use ofsemiconductor die products, including? wafers,? singulated bare die,? die and wafers with attached connection structures,? minimally or partially encapsulated die and wafers.The standard defines the minimum requirements for the data that are needed to describe suchdie products and is intended as an aid to the design of and procurement for assembliesincorporating die products. It covers the requirements for data, including? product identity? product data? die mechanical information? test, quality, assembly and reliability information? handling, shipping and storage informationIt covers the specific requirements for the data that are needed to describe the geometricalproperties of die, their physical properties and the means of connection necessary for their usein the development and manufacture of products. It also contains, in the annexes, a vocabularyand list of common acronyms.